In this paper, a mathematical model for the sub-process of gluing in the manufacturing process of particleboards is presented. The model describes the application of resin droplets onto wood particles on laboratory scale. At the moment the model and simulations are carried out for the problem considered in two dimensions. The developed mathematical model uses lattice gas cellular automata for the movement of the wood particles, and random walk for the movement of the resin droplets. Feasibility was shown with simulation results of a greatly simplified mathematical model in two dimensions. This model was developed further for a better fitting to the real process. First simulation results of this more detailed model are presented. The next step will be the specification of how validation will be performed. In future, it is planned to create a mathematical model in three dimensions.